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Two students from School of Electrical and Electronic Engineering (EEE) have made the school proud by clinching the 2nd Runner-Up position at the Singapore AI Capture the Flag (CTF) 2025 — a prestigious national competition that draws participation from top students across local polytechnics, junior colleges, and pre-university institutions.

 Danial Alexander DiDonato and Mohamed Ukkash, both Diploma in Computer Engineering (DCPE) students, achieved this outstanding result while on internship at Terra Systems, a long-term industry partner of EEE. Together with two interns from the School of Computing (SoC), they formed a strong interdisciplinary team that showcased exceptional technical and problem-solving skills in AI and cybersecurity.

 During their internship, Ukkash and Danial were mentored by Terra Systems’ Managing Director, Mr Roy Toh, and were encouraged to apply their learning beyond the classroom. Their hands-on experience in real-world cybersecurity and AI projects provided them with the confidence and technical depth to perform under pressure at the national competition — a testament to the value of SP’s industry-integrated internship programme.

 The team’s success at the Singapore AI CTF not only brought recognition to Singapore Polytechnic but also attracted attention from the Cyber Security Agency of Singapore (CSA) and local media. This collaboration highlights how meaningful internships can empower SP students to innovate, compete, and excel at national and international levels.

 Mr Toh commended the students’ performance and shared his appreciation for SP’s strong internship collaboration:

“We’ve been working with SP interns for the past ten years, and they consistently demonstrate great technical ability and professionalism. This achievement is a reflection of the quality of SP’s engineering education and mentorship.”

 Congratulations to Ukkash and Danial for their remarkable achievement — a shining example of how EEE internships bridge classroom learning with real-world innovation and impact.